By Duixian Liu; et al
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Additional resources for Advanced millimeter-wave technologies : antennas, packaging and circuits
Orner, H. Ding, R. Wachnik, and K. Walter, ‘Silicon germanium based millimetre-wave ICs for Gbps wireless communications and radar systems’, Semiconductor Science and Technology 22(1) (2007), S236– S243.  S. Reynolds, B. Floyd, U. Pfeiffer, T. Beukema, J. Grzyb, C. Haymes, B. Gaucher, and M. Soyuer, ‘A silicon 60 GHz receiver and transmitter chipset for broadband communications’, IEEE J. SolidState Circuits 41(12) (2006), 2820–30.  B. Floyd, S. Reynolds, U. Pfeiffer, T. Beukema, J. Grzyb, and C.
Over time such dots may move, depending on market conditions and volumes. From a business point of view, areas with maximized profit margins are preferred and emerging markets have to be identified. Most of today’s mmWave packaging technologies are likely to be located at the top-right quadrant, where excellent package performance has been achieved, but where the mmWave package is far too expensive and cannot follow the die cost reduction. A simple transition from the top-right to the top-left side has been prevented so far by technology barriers because the existing packaging technologies could not achieve a real breakthrough in cost MILLIMETER-WAVE PACKAGING 25 High electrical performance Packaging 'Nobel Prize' Today’s mmWave Packaging Technologies io n Technology barriers Transition difficult High cost In te gr at Low cost 'Emerging Markets' High volumes are here New innovations required Deal with low performance No business here!
SolidState Circuits 41(12) (2006), 2820–30.  B. Floyd, S. Reynolds, U. Pfeiffer, T. Beukema, J. Grzyb, and C. Haymes, ‘A silicon 60GHz receiver and transmitter chipset for broadband communications’, IEEE ISSCC Dig. Tech. Papers, February 2006, pp. 184–5.  N. , ‘High-efficiency 60 GHz antenna fabricated using low-cost silicon micromachining techniques’, IEEE International Symposium on Antennas and Propagation, Honolulu, Hawaii, June 9–15, 2007, pp. 5043–46. 2 Millimeter-wave Packaging Ullrich Pfeiffer List of Acronyms µPGA Micro PGA ASK Amplitude shift keying BCA Bare chip attach BCC Bump chip carrier BEOL Back-end-of-the-line BGA Ball grid array BiCMOS Bipolar CMOS BIST Built-in self-test BT Bismaleide-triazine C4 Controlled collapse chip connection CLCC Ceramic leaded chip carrier CMOS Complementary metal–oxide–semiconductor CNC Computer numerical control COB Chip on board Advanced Millimeter-Wave Technologies: Antennas, Packaging and Circuits Duixian Liu, Brian Gaucher, Ulrich Pfeiffer and Janusz Grzyb © 2009 John Wiley & Sons, Ltd.
Advanced millimeter-wave technologies : antennas, packaging and circuits by Duixian Liu; et al